XCube
March 1st 2021:
The XCube team is currently split up into two teams: the testing team and analysis team. The testing team, mainly consisting of the Software and Electronics members, is focusing on testing the communication protocols and power-on testing for the XCube system. This will give the team insight into how the PPAC, the power handling board, and MOAP, the communications board, will work with payloads and how they can accommodate different itnerfaces.
The analysis team is focusing on the structural analysis of the XCube System. The main concern is the buckling or fastener failure in the structure due to the high G-loads (9g down and 4.5g lateral load). The team is in an open dialogue with the structural and mechanical engineers at NASA: Armstrong to ensure the analysis is valid and representative of the real-life loads.
November 3rd 2020:
Structures:
The structures team is finalizing the parts they need for the rest of the build. Remaining hardware/parts/stock to be ordered soon. They are also working on manufacturing the components (i.e. Capacitor enclosure, Replacement Mounting Plates, MOAP Mounting Bracket Modification).Once all parts are manufactured and test assembled, parts will be sent to get alodine treatment.
Electronics:
In the month of October, the electronics team met with NASA Armstrong to discuss interfacing to ER-2 and sent them a wiring diagram for review. The team continues to perform modifications, check-outs, and testing.
Software:The software team continues to develop the remaining data protocols for XCube.
October 7th 2020:
Program: NASA ER-2 aircrafts are undergoing maintenance and are expected to host flights starting early 2021.
Structures: The team is going through the test assembly and had to modify some parts (ie. MOAP, due to machining errors). They are also creating a new enclosure for high voltage capacitors, since the product page provided incorrect data/drawings. They also need to finish ordering parts and machining stock before sending all parts to get alodine treatment.
Electronics: The team is performing check-outs and testing. Some issues have been identified and procedures for modifying them are being written.
Software: 2 SW members are researching the I2C and SPI data protocols before developing the software for XCube. We still need to test SPI, I2C, Serial, and Ethernet data protocols before the final flash onto boards.
August–September 2020:
In the month of August, the XCube team has mainly been progressing on documentation, putting together analysis packages. and preparing the work plan for when there is more personnel available in San Luis Obispo to work on the project. The structures team is currently waiting on parts to come in while the software and electronics team are assisting in documentation.